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OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging

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OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging

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Brand Name : Guofeng

Model Number : 7.5um

Certification : SGS ROHS

Place of Origin : China Hefei

MOQ : 5kg

Price : $300-$30000

Payment Terms : L/C,T/T

Supply Ability : Negotiation

Delivery Time : Negotiation

Packaging Details : Barrier+ PE foam sheet+ PE film+ Foam packing cotton

Film Appearance : The surface must be perfectly planar and devoid of any wrinkles, bubbles, gel particles, or particulate contamination.

Film Thickness : 7.5μm

Film Tensile Strengthh : 230MPa

Film Elongation at break : 30%

Film Young's Modulus : 4.3GPa

Film Insulation Strength : 250V/μm

Film Moisture absorption : 1425Kg/m³

Film Thermal Shrinkage(200°，2h) : 0.08%

Film Linear expansion coefficient : 22ppm

Film Moisture absorption rate : 1.4%

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GL-7.5 Ultra-thin Polyimide Yellow Film
Our GL series is a biaxially oriented, natural yellow polyimide film, independently developed and manufactured. It is offered in three distinct thicknesses and formulations, primarily for use in adhesive substrates and chip packaging applications.
Key Advantages:

Engineered for excellence, this advanced material delivers unmatched mechanical integrity, electrical insulation, and heat resistance. It ensures superior bonding adhesion for reliable assembly and is certified to meet global environmental (RoHS/REACH) and safety (UL) standards.

Product application:
GL standard polyimide film serves as an essential manufacturing element for flexible printed circuit coverlays, high-density connectors, and advanced insulating tapes.
Place of Origin:
ANHUI, CHINA
Certification:
SGS, FDA
Material:
Polyimide
Color:
Yellow
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Thickness:
7.5μm
Packaging:
Wooden pallet
Product Features
This material exhibits exceptional mechanical properties, including high tensile strength and durability, along with outstanding dimensional stability attributable to its extremely low coefficient of thermal expansion (CTE). It is characterized by superior adhesion for secure integration and is verified to be fully compliant with international RoHS and REACH environmental regulations. The product also holds safety certification from Underwriters Laboratories (UL).
Product Applications

GL high-performance polyimide film functions as a fundamental component in next-generation electronics, delivering essential performance characteristics for precision adhesive FCCLs, dimensionally stable coverlays, advanced semiconductor packaging, and specialized tape applications.

Product Images
OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip PackagingOEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging



Product Tags:

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OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging Images

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